87933-1818
Slim-Grid Header, 18 Circuits, Surface Mount, Vertical, Unshrouded, 0.38µm Select Gold (Au) Plated, with Pick-and-Place Cap, Tube, Lead-Free
Enhance your circuit connections with this Slim-Grid Header featuring 18 circuits for optimal performance. Designed for surface mount applications, this vertical connector boasts unshrouded, 0.38µm Select Gold (Au) plating for reliable conductivity. The inclusion of a Pick-and-Place Cap streamlines assembly processes. With a compact pitch of 1.27mm, it offers a space-efficient solution for your PCB layout. Constructed with high-quality materials including Copper Alloy contacts and Liquid Crystal Polymer, it ensures durability in operation. Meeting stringent standards, this lead-free connector is suitable for environmentally-conscious projects. Its robust design, with a mating cycle of 500, guarantees long-term functionality. Perfect for board-to-board connections, it offers versatility in various electronic applications. The sleek black finish adds a professional touch to your design. Upgrade your connectivity with this premium Slim-Grid Header.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 87933-1818 |
| Color: | Black |
| Series: | 87933 - Slim-Grid |
| Amperage: | 1.4 A |
| Connector Type: | Slim-Grid |
| Number of Contacts: | 18 |
| Number of Rows: | 2 |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Pitch: | 1.27 mm |
| Voltage: | 125 V AC |
| Material: | Liquid Crystal Polymer |
| Orientation: | Vertical |
| Keying: | No |
| Packaging: | Tube |
| Pick and Place: | With Pick and Place Cap |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .381 µm |
| Number of Contacts Loaded: | 18 |
| Mating Cycles: | 500 |
| PCB Locator: | No |
| PCB Retention: | Without |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | 2.032 µm |
| Polarized to Mate: | No |
| Connector System: | Board to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 011 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Termination Pitch: | 1.27 mm |
| Glow Wire Capable: | No |
| Guide to Mating Part: | No |
| Lock to Mating Part: | No |
| Breakaway: | Yes |
| Make First / Break Last: | No |
| Shroud Type: | No |
| Part Aliases: | 0879331818 |
| SKU: | MOL87933-1818 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |