46015-0202

Mini-Fit Plus Header, Dual Row, Vertical, 2 Circuits, without Snap-in Plastic Peg PCB Lock, without Drain Holes, PA Polyamide Nylon 6/6, UL 94V-0, Tin (Sn) 1.27

Enhance your PCB connections with our Mini-Fit Plus Header, designed for optimal performance in dual-row configurations. This vertical header features 2 circuits and is crafted from PA Polyamide Nylon 6/6 for durability, meeting UL 94V-0 standards. With Tin (Sn) plating, it ensures reliable conductivity, while its through-hole termination method offers secure attachment. Operating at temperatures ranging from -40 to 105 °C, it's suitable for various environments. Its straight body orientation, 4.2 mm pitch, and 600 V voltage rating make it versatile for different applications. Perfect for wire-to-board connections, this header is an essential component in your electronic projects. Rest assured, it complies with RoHS standards for environmental responsibility. Elevate your PCB design with this high-quality Mini-Fit Plus Header.
Availability
Immediate Shipment: NA
Stock Location: In Stock
Factory Stock: Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple: NA/NA
Pricing
CALL: 800.400.7041
Product Category:
Manufacturer: Molex
Manufacturer Part Number: 46015-0202
Color: Natural
Series: 46015 - Mini-Fit Plus
Amperage: 13 A
Connector Type: Mini-Fit Plus
Number of Contacts: 2
Number of Rows: 2
Termination Method: Through Hole
Contact Material: Copper Alloy
Body Orientation: Straight
Pitch: 4.2 mm
Voltage: 600 V
Material: Nylon
Orientation: Vertical
Keying: No
Tail Length: 1.8 mm
Packaging: Tray
Operating Temperature Range: -40 - 105 °C
Contact Mating Area Plating: Tin
Contact Mating Area Plating Thickness: 2.54 µm
Number of Contacts Loaded: 2
Mating Cycles: 75
PCB Locator: Yes
PCB Retention: Without
Polarized to PCB: Yes
Contact Termination Plating Thickness: 1.27 µm
Polarized to Mate: Yes
PCB Thickness (Recommended): 1.78 mm
Connector System: Wire to Board
CSA Agency Certification: LR19980
UL Agency Certification: E29179
Contact Termination Plating: Tin
Maximum Solder Process Temperature: 260 °C
Lead Free Process Capability: WAVE
Duration at Max. Process Temperature (seconds): 005
Max. Cycles at Max. Process Temperature: 001
Glow Wire Capable: No
Guide to Mating Part: No
Lock to Mating Part: Yes
Stackable: No
Surface Mount Compatible: No
Breakaway: No
Make First / Break Last: No
Shroud Type: Fully
Product Name: Mini-Fit Plus
Material Flammability Standard: 94V-0
Part Aliases: 0460150202
SKU: MOL46015-0202

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes:

Product Change Notice

Effective Date Description of Change Download
02/24/2023 512909 - Capacity change or tool replacement. This notice is to inform you that Molex Lincoln Nebraska is adding additional tooling that will affect the
product listed. New tooling will be exact replica of current tooling. There will be no change to the
product Fit, Form, Function or Appearance when compared to current tooling.
Download
07/18/2022 510809 - Change to product. current vertical header housings have a drain hole and non-drain hole version housing the drain holes are no longer needed (they were used in the past when PCB boards were being washed and are no longer needed) therefore we are eliminating the drain hole option going forward Download
02/14/2022 511607 - Retraction of PCN 510948. This PCN is a retraction/ recall of PCN 510809 communicated on 1/18/22 for "current vertical header housings have a drain hole and non-drain hole version housing the drain holes are no longer needed (they were used in the past when PCB boards were being washed and are no longer needed) therefore we are eliminating the drain hole option going forward." the reason for retraction is that part numbers that did not contain the drain hole option were included in the impacted parts list used to create pcn 510809 a new pcn will be created and customers will be notified Download
03/01/2021 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) Download
07/15/2015 GCM 10673768 - New, Modified, Or Replacement Tooling. Download