1-85969-9
MOD IV RECP STMPD
Enhance your connectivity with our high-performance MOD IV RECP STMPD connector. Designed for optimal power and signal transmission, this component ensures reliable performance in industrial settings. With CSA and UL certifications, you can trust in its quality and safety. Its beryllium copper contact material and gold plating guarantee efficient conductivity, while its crimp termination method offers easy installation. Operating within a wide temperature range, from -65 to 105°C, and withstanding voltages up to 750 VAC, this connector is suitable for diverse applications. Each package contains 12,500 pieces, making it ideal for large-scale projects. RoHS-compliant and featuring nickel plating for durability, this connector is a must-have for your wiring needs.
| Product Category: | |
|---|---|
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | 1-85969-9 |
| Series: | AMPMODU IV/V |
| Amperage: | 3 A |
| Termination Method: | Crimp |
| Contact Material: | Beryllium Copper |
| Voltage: | 250 VAC |
| Contact Type: | Socket |
| Package Quantity: | 12500 |
| Insulation Resistance: | 5000 MΩ |
| GPL: | 277 |
| Packaging: | Strip |
| Operating Temperature Range: | -65 - 105 °C |
| Circuit Application: | Power & Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 15 µin |
| PCB Contact Termination Area Plating: | Nickel |
| GPL Description: | Industrial |
| Product Code: | 5921 |
| Wire Size: | 20 - 24 AWG, .2 - .6 mm² |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 750 V |
| Termination Resistance: | 12 mΩ |
| Applied_Pressure: | Standard |
| Wire Insulation Support: | With |
| Accepts Wire Insulation Diameter: | .069 in, 1.75 mm |
| Wire Contact Termination Area Plating Material: | Nickel |
| Wire Contact Termination Area Plating Thickness: | 15 µin |
| Standards Met: | CSA LR7189;UL E28476 |
| Part Aliases: | 1-85969-9 |
| SKU: | AMP1-85969-9 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 03/01/2015 | E-14-017571 - PRODUCT IMPROVEMENT. CU-NI-SI MATERIAL PASSES 108-25020 REQUIREMENTS. STANDARDIZATION OF THE BASE MATERIAL OF MOD IV RECEPTACLE CONTACTS. MATERIAL CHANGE FROM BERYLLIUM COPPER TO COPPER-NICKEL-SILICON. | Download |
| 04/01/2013 | Project Lantern PTP Migration Parts - MNF. location change from NC. | Download |