5223524-4
2MMFB,5R,ASY,120,SIG,HDR,EN
Enhance your connectivity with the Z-PACK Future Bus+ Board Mount Connector, designed for seamless integration in power and signal applications. This high-performance connector boasts a 5-row configuration, featuring 120 gold-plated pin contacts with a pitch of 2 mm for efficient data transfer. With a rugged LCP housing in a natural color, it offers durability and reliability in diverse operating environments. UL 94V-0 rated for flame resistance, it ensures safety in all applications. The through-hole press-fit termination method guarantees secure and stable connections, while the right-angle mount orientation and polarization mating alignment facilitate easy installation. Meeting RoHS compliance standards, this connector is not just efficient but also environmentally friendly. Elevate your PCB connectivity with the Z-PACK Future Bus+ Connector.
| Product Category: | |
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| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | 5223524-4 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Pin |
| Impedance: | 120 Ω |
| Package Quantity: | 12 |
| Contact Amperage: | 3 A |
| Number of Positions: | 120 |
| Housing Color: | Natural |
| Mount Orientation: | Right Angle |
| Insulation Resistance: | 5 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Power & Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 29.921 µin, .5 µm |
| PCB Retention: | Without |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 1.3 mm, .5 in |
| Connector Height: | 13.5 mm, .531 in |
| PCB Retention Type: | Action/Compliant Tail |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 2370 |
| Number of Signal Positions: | 120 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Right Angle |
| Contact Mating Area Plating Finish: | Matte |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .132 in, 3.35 mm |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | 1.969 µin, .5 µm |
| Contact Mating Area Length: | .226 in, 5.75 mm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223524-4 |
| SKU: | AMP5223524-4 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |