Enhance your power connectivity with the Z-PACK Future Bus+ Board Mount Connector. Featuring a robust housing made of LCP (Liquid Crystal Polymer), this connector offers reliable performance in various applications. With four rows and eight positions, it provides ample connectivity options. The termination method of Through Hole - Press-Fit ensures secure attachment to the PCB. Operating at temperatures ranging from -55 to 125°C (-67 to 257°F), it is suitable for demanding environments. The contact material of Phosphor Bronze with Gold Flash plating guarantees excellent conductivity. Designed for Futurebus+ interface, this connector is ideal for power applications. Compliant with UL 94V-0 flammability standards and RoHS regulations, it meets safety and environmental requirements. With a compact vertical mount orientation and a package quantity of 48, it offers efficient PCB integration. Experience seamless power transmission with this high-quality connector.
