787362-9
100 50SR R/A,REDESIGN
Enhance connectivity with our AMPLIMITE 0.50 Series D-Sub Receptacle, featuring high-performance UL E28476 and UL 94V-0 standards compliance for optimal safety and reliability. With 100 gold-plated contacts on a durable thermoplastic housing, this connector ensures secure board-mounting through-hole solder termination. Designed with precision, it offers a pitch of 1.27mm and a full metal shell for robust protection. Suitable for various applications, this connector guarantees efficient signal transmission with its phosphor bronze contacts, making it an essential component in any electronic setup.
| Product Category: | |
|---|---|
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | 787362-9 |
| Series: | AMPLIMITE 0.50 Series |
| Amperage: | 1 A |
| Gender: | Receptacle |
| Housing Material: | Thermoplastic |
| Number of Contacts: | 100 |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Pitch: | 1.27 mm |
| Terminal Type: | Solder |
| Number of Positions: | 100 |
| Profile: | Standard |
| Packaging: | Tube |
| Shell Type: | Full Metal Shell |
| Standards Met: | UL E28476 ;UL 94V-0 |
| SKU: | AMP787362-9 |
| Shell Plating Finish: | Bright |
| Post Size: | .012 in |
| Bracket Material: | Zinc |
| Bracket Plating Material: | Nickel over Copper |
| Shell Plating Material: | Nickel |
| Shell Material: | Carbon Steel |
| PCB Mount Orientation: | Right Angle |
| PCB Contact Termination Area Plating Material: | Tin-Lead |
| Contact Underplating Material: | Nickel |
| Contact Mating Area Plating Thickness: | 30 µin |
| Contact Base Material: | Phosphor Bronze |
| PCB Thickness (Recommended): | .093 in / 2.36 mm |
| Centerline (Pitch): | 1.27 mm / .05 in |
| Housing Color: | Black |
| Housing Material: | Thermoplastic |
| Approved Standards: | UL E28476 |
| UL Flammability Rating: | UL 94V-0 |
| PCB Mounting Style: | Through Hole - Solder |
| Montageausrichtung der Leiterplatte: | Without |
| Boardlock Material: | Copper Alloy |
| Mating Retention: | Without |
| Boardlock Plating Material: | Tin-Lead over Nickel |
| Connector Mounting Type: | Board Mount |
| PCB Mount Alignment: | Without |
| PCB Mount Retention Type: | Boardlock |
| Mating Connector Lock Type: | Mounting Holes |
| PCB Mount Retention: | With |
| Mating Alignment: | Without |
| Mating Connector Lock: | With |
| Mounting Hole Diameter: | .109 in |
| Circuit Application: | Signal |
| Connector System: | Cable-to-Board |
| Product Type: | Connector |
| Row-to-Row Spacing: | .1 in / 2.54 mm |
| Shielded: | Yes |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Connector Type: | Connector Assembly |
| Sealable: | No |
| Termination Post Length: | 3.05 mm / .12 in |
| Operating Temperature Range: | -55 - 105 °C / -67 - 221 °F |
| Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |