1-5223083-3
FB-5R,ASY,120,SIG,HDR,3LEV SEQ
Introducing the FB-5R Future Bus+ Header, a versatile connectivity solution designed for power and signal applications. This through-hole press-fit connector features a 3-level sequencing design with 120 gold-plated pin contacts, ensuring reliable performance in high-speed data transmission. With a 120-ohm impedance and 30V AC voltage rating, it meets stringent industry standards for quality and safety. The LCP housing, UL 94V-0 rated for flammability, offers durability and protection in rugged environments. Perfect for board-to-board configurations, this connector is ideal for a wide range of electronic systems. RoHS compliant and ECCN EAR99, it guarantees compliance with international regulations. Upgrade your connectivity with the FB-5R Future Bus+ Header.
Product Category: | |
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Manufacturer: | TE Connectivity |
Manufacturer Part Number: | 1-5223083-3 |
Series: | Z-PACK Future Bus+ |
Housing Material: | LCP (Liquid Crystal Polymer) |
Number of Rows: | 5 |
Mount Type: | Board Mount |
Termination Method: | Through Hole - Press-Fit |
Contact Material: | Phosphor Bronze |
Pitch: | .079 in, 2 mm |
Voltage: | 30 V AC |
Contact Type: | Pin |
Impedance: | 120 Ω |
Package Quantity: | 12 |
Contact Amperage: | 3 A |
Number of Positions: | 120 |
Housing Color: | Natural |
Mount Orientation: | Vertical |
Insulation Resistance: | 5 MΩ |
GPL: | 473 |
Packaging: | Tube |
Operating Temperature Range: | -67 - 257 °F |
Circuit Application: | Power & Signal |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
PCB Retention: | With |
PCB Contact Termination Area Plating: | Tin |
PCB Thickness (Recommended): | 2.4 mm, .76 in |
Connector Height: | 17 mm, .668 in |
PCB Retention Type: | Action/Compliant Tail |
Sealable: | No |
Mating Alignment: | With |
Mating Alignment Type: | Polarization |
GPL Description: | Data and Devices |
Connector and Contact Terminate To: | Printed Circuit Board |
Product Code: | 3964 |
Number of Signal Positions: | 120 |
Contact Layout: | Matrix |
Connector System: | Board to Board |
Stackable: | No |
ECCN: | EAR99 |
Dielectric Withstanding Voltage: | 1000 V AC |
Board to Board Configuration: | Vertical |
Contact Mating Area Plating Finish: | Matte |
Connector Width: | 17.8 mm, .701 in |
PCB Mount Alignment: | Without |
Application Solder Feature: | Board Standoff |
Termination Post Tail Length: | .167 in, 4.25 mm |
Connector Assembly Type: | PCB Mount Header |
PCB Contact Termination Area Plating Thickness: | .06 µm, 2.362 µin |
Mating / Unmating Configuration: | Sequencing |
Material Flammability Standard: | UL 94V-0 |
Part Aliases: | 1-5223083-3 |
SKU: | AMP1-5223083-3 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |