Introducing the Z-PACK Future Bus+ Board Mount Connector, a high-performance solution for seamless connectivity in advanced electronic systems. With a compact design and a right-angle mount orientation, this connector is perfect for space-constrained applications. Featuring 144 socket contacts with a 2mm pitch, it ensures reliable data transmission. The natural housing color blends seamlessly with any PCB design, while its wide operating temperature range of -55 to 125°C (-67 to 257°F) guarantees performance in harsh environments. RoHS compliant and ECCN EAR99, this connector is not only efficient but also environmentally friendly. Ideal for backplane configurations, it is the perfect choice for your board-to-board connectivity needs.
Availability
Immediate Shipment: NA
Stock Location: In Stock
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Minimum/Multiple: NA/NA
Pricing
CALL: 800.400.7041
Product Category:
Manufacturer: TE Connectivity
Manufacturer Part Number: 5536587-1
Series: Z-PACK Future Bus+
Number of Rows: 4
Mount Type: Board Mount
Pitch: .078 in, 2 mm
Contact Type: Socket
Number of Positions: 144
Housing Color: Natural
Mount Orientation: Right Angle
GPL: 473
Operating Temperature Range: -55 - 125 °C, -67 - 257 °F
Sealable: No
GPL Description: Data and Devices
Connector and Contact Terminate To: Printed Circuit Board
Product Code: 1830
Connector System: Board to Board
ECCN: EAR99
Board to Board Configuration: Backplane
Connector Assembly Type: PCB Mount Receptacle
CompactPCI Designation: None
Part Aliases: 5536587-1
SKU: AMP5536587-1

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes: