5223652-4
2MM FB,5RV,REC,ASY,120,PF,4.25
Enhance your connectivity with the Z-PACK Future Bus+ Board Mount Socket, a high-performance solution designed for signal transmission in demanding environments. Featuring a durable LCP housing in a natural color, this connector ensures reliable operation with its UL 94V-0 material flammability standard. With 120 phosphor bronze contacts plated in gold for optimal conductivity, it offers a contact amperage of 3A and impedance of 120Ω, making it ideal for signal applications. The Through Hole - Press-Fit termination method and vertical mount orientation provide secure attachment to a 2.4mm thick PCB. Operating in a wide temperature range from -67 to 257°F, this connector is suitable for various electronic systems. RoHS compliant and with 1000V AC dielectric withstanding voltage, it guarantees safety and environmental responsibility. Perfect for PCB assembly, this connector is a crucial component in data and device connectivity, meeting the highest industry standards. With its compact design and efficient performance, the Z-PACK Future Bus+ Socket is the perfect choice for your connectivity needs.
Product Category: | |
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Manufacturer: | TE Connectivity |
Manufacturer Part Number: | 5223652-4 |
Series: | Z-PACK Future Bus+ |
Housing Material: | LCP (Liquid Crystal Polymer) |
Number of Rows: | 5 |
Mount Type: | Board Mount |
Termination Method: | Through Hole - Press-Fit |
Contact Material: | Phosphor Bronze |
Pitch: | .079 in, 2 mm |
Voltage: | 30 V AC |
Contact Type: | Socket |
Impedance: | 120 Ω |
Package Quantity: | 10 |
Contact Amperage: | 3 A |
Number of Positions: | 120 |
Housing Color: | Natural |
Mount Orientation: | Vertical |
Insulation Resistance: | 5 MΩ |
GPL: | 473 |
Packaging: | Tube |
Operating Temperature Range: | -67 - 257 °F |
Circuit Application: | Signal |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | 29.921 µin, .76 µm |
PCB Retention: | Without |
Contact Underplating Material: | Nickel |
PCB Contact Termination Area Plating: | Tin |
PCB Thickness (Recommended): | 2.4 mm, .76 in |
Connector Height: | 14.3 mm, .562 in |
PCB Retention Type: | Action/Compliant Tail |
Sealable: | No |
Mating Alignment: | With |
Mating Alignment Type: | Polarization |
GPL Description: | Data and Devices |
Connector and Contact Terminate To: | Printed Circuit Board |
Product Code: | D021 |
Number of Signal Positions: | 120 |
Contact Layout: | Matrix |
Connector System: | Board to Board |
Stackable: | No |
ECCN: | EAR99 |
Dielectric Withstanding Voltage: | 1000 V AC |
Board to Board Configuration: | Vertical |
Contact Mating Area Plating Finish: | Matte |
PCB Mount Alignment: | With |
PCB Mount Alignment Type: | Locating Posts |
Termination Post Tail Length: | .167 in, 4.25 mm |
Connector Assembly Type: | PCB Mount Receptacle |
PCB Contact Termination Area Plating Thickness: | 23.622 µin, .6 µm |
Material Flammability Standard: | UL 94V-0 |
Part Aliases: | 5223652-4 |
SKU: | AMP5223652-4 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |