1-5223007-0
FB-5R,ASY,300,SIG,REC,SL,3.53
Introducing the FB-5R Board Mount Receptacle, a key component in our Z-PACK Future Bus+ series. This high-performance connector features a 5-row design with 300 signal positions, perfect for power and signal applications. Crafted with durable LCP housing and phosphor bronze contacts plated with gold, it ensures reliable connectivity in demanding environments. With an impedance of 300 Ω and a voltage rating of 30 V AC, it meets stringent standards for performance and safety. The right-angle mount orientation and through-hole solder termination method offer easy and secure installation on PCBs. RoHS compliant and UL 94V-0 certified for material flammability, this connector guarantees compliance with environmental regulations. Whether in data centers, telecommunications, or industrial systems, the FB-5R delivers efficient and secure board-to-board connections.
Product Category: | |
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Manufacturer: | TE Connectivity |
Manufacturer Part Number: | 1-5223007-0 |
Series: | Z-PACK Future Bus+ |
Housing Material: | LCP (Liquid Crystal Polymer) |
Number of Rows: | 5 |
Mount Type: | Board Mount |
Termination Method: | Through Hole - Solder |
Contact Material: | Phosphor Bronze |
Pitch: | .079 in, 2 mm |
Voltage: | 30 V AC |
Contact Type: | Socket |
Impedance: | 300 Ω |
Package Quantity: | 4 |
Contact Amperage: | 3 A |
Number of Positions: | 300 |
Housing Color: | Natural |
Mount Orientation: | Right Angle |
Insulation Resistance: | 5 MΩ |
GPL: | 473 |
Packaging: | Tube |
Operating Temperature Range: | -67 - 257 °F |
Circuit Application: | Power & Signal |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
PCB Retention: | Without |
PCB Contact Termination Area Plating: | Tin |
PCB Thickness (Recommended): | 1.3 mm, .76 in |
Connector Height: | 13.3 mm, .523 in |
Sealable: | No |
Mating Alignment: | With |
Mating Alignment Type: | Polarization |
GPL Description: | Data and Devices |
Connector and Contact Terminate To: | Printed Circuit Board |
Product Code: | 3963 |
Number of Signal Positions: | 300 |
Contact Layout: | Matrix |
Connector System: | Board to Board |
Stackable: | No |
ECCN: | EAR99 |
Dielectric Withstanding Voltage: | 1000 V AC |
Board to Board Configuration: | Right Angle |
Contact Mating Area Plating Finish: | Matte |
Contact Shape: | Dual Beam |
PCB Mount Alignment: | With |
PCB Mount Alignment Type: | Locating Posts |
Application Solder Feature: | Board Standoff |
Termination Post Tail Length: | .139 in, 3.53 mm |
Connector Assembly Type: | PCB Mount Receptacle |
PCB Contact Termination Area Plating Thickness: | 150 µin, 3.81 µm |
Material Flammability Standard: | UL 94V-0 |
Part Aliases: | 1-5223007-0 |
SKU: | AMP1-5223007-0 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |