Elevate your signal transmission with this Z-PACK Future Bus+ board-to-board connector. Designed for high-performance applications, it features a 60-position, 5-row matrix layout for seamless connectivity. With a pitch of 2mm and an impedance of 60Ω, it ensures reliable data transfer. The housing, made of UL 94V-0 rated LCP, offers robust protection. Gold-plated contacts and a phosphor bronze construction guarantee optimal signal integrity. Operating in a wide temperature range from -67 to 257°F, it's suitable for diverse environments. With through-hole solder termination, PCB retention, and polarization for mating alignment, it provides ease of installation. RoHS compliant and offering 3A contact amperage and 30V AC voltage rating, it meets stringent quality standards. Perfect for demanding circuit applications, this connector is a vital component in ensuring efficient signal transmission on your PCBs.
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Product Category:
Manufacturer: TE Connectivity
Manufacturer Part Number: 5223010-2
Series: Z-PACK Future Bus+
Housing Material: LCP (Liquid Crystal Polymer)
Number of Rows: 5
Mount Type: Board Mount
Termination Method: Through Hole - Solder
Contact Material: Phosphor Bronze
Pitch: .079 in, 2 mm
Voltage: 30 V AC
Contact Type: Pin
Impedance: 60 Ω
Package Quantity: 24
Contact Amperage: 3 A
Number of Positions: 60
Housing Color: Natural
Mount Orientation: Vertical
Insulation Resistance: 5 MΩ
GPL: 473
Packaging: Tube
Operating Temperature Range: -67 - 257 °F
Circuit Application: Signal
Contact Mating Area Plating: Gold
Contact Mating Area Plating Thickness: 29.921 µin, .76 µm
PCB Retention: With
PCB Contact Termination Area Plating: Tin
PCB Thickness (Recommended): 2.4 mm, .76 in
Connector Height: 17.8 mm, .7 in
PCB Retention Type: Solder Tail
Sealable: No
Mating Alignment: With
Mating Alignment Type: Polarization
GPL Description: Data and Devices
Connector and Contact Terminate To: Printed Circuit Board
Product Code: 3964
Number of Signal Positions: 60
Contact Layout: Matrix
Connector System: Board to Board
Stackable: No
ECCN: EAR99
Dielectric Withstanding Voltage: 1000 V AC
Board to Board Configuration: Vertical
Contact Mating Area Plating Finish: Matte
Connector Width: 18 mm, .709 in
PCB Mount Alignment: With
PCB Mount Alignment Type: Locating Posts
Application Solder Feature: Board Standoff
Termination Post Tail Length: .167 in, 4.25 mm
Connector Assembly Type: PCB Mount Header
PCB Contact Termination Area Plating Thickness: 150 µin, 3.81 µm
Contact Mating Area Length: .197 in, 5 mm
Material Flammability Standard: UL 94V-0
Part Aliases: 5223010-2
SKU: AMP5223010-2

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes: