5223008-3
FB-5R,ASY,090,SIG,REC,EN,3.55
Experience high-speed signal transmission with the FB-5R Board Mount Receptacle from our Z-PACK Future Bus+ series. Featuring a robust housing made of LCP (Liquid Crystal Polymer) in a natural color, this connector is designed for through-hole press-fit termination on printed circuit boards. With a 2mm pitch and 90Ω impedance, it offers reliable performance for signal applications. The contact layout in a matrix configuration, with 90 signal positions and dual-beam contact shape, ensures optimal connectivity. Operating in a wide temperature range from -67 to 257°F, this connector is suitable for various environments. Its gold-plated mating area provides excellent conductivity, while the UL 94V-0 material flammability standard guarantees safety. With a package quantity of 16 and RoHS compliance, it's an ideal choice for electronic assemblies.
Product Category: | |
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Manufacturer: | TE Connectivity |
Manufacturer Part Number: | 5223008-3 |
Series: | Z-PACK Future Bus+ |
Housing Material: | LCP (Liquid Crystal Polymer) |
Number of Rows: | 5 |
Mount Type: | Board Mount |
Termination Method: | Through Hole - Press-Fit |
Contact Material: | Phosphor Bronze |
Pitch: | .079 in, 2 mm |
Voltage: | 30 V AC |
Contact Type: | Socket |
Impedance: | 90 Ω |
Package Quantity: | 16 |
Contact Amperage: | 3 A |
Number of Positions: | 90 |
Housing Color: | Natural |
Mount Orientation: | Right Angle |
Insulation Resistance: | 5 MΩ |
GPL: | 473 |
Packaging: | Tube |
Operating Temperature Range: | -67 - 257 °F |
Circuit Application: | Signal |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | 29.921 µin, .76 µm |
PCB Retention: | Without |
PCB Contact Termination Area Plating: | Tin |
PCB Thickness (Recommended): | 1.3 mm, .76 in |
Connector Height: | 13.3 mm, .523 in |
Sealable: | No |
Mating Alignment: | With |
Mating Alignment Type: | Polarization |
GPL Description: | Data and Devices |
Connector and Contact Terminate To: | Printed Circuit Board |
Product Code: | 3963 |
Number of Signal Positions: | 90 |
Contact Layout: | Matrix |
Connector System: | Board to Board |
Stackable: | No |
ECCN: | EAR99 |
Dielectric Withstanding Voltage: | 1000 V AC |
Board to Board Configuration: | Right Angle |
Contact Mating Area Plating Finish: | Matte |
Contact Shape: | Dual Beam |
PCB Mount Alignment: | With |
PCB Mount Alignment Type: | Locating Posts |
Application Solder Feature: | Board Standoff |
Termination Post Tail Length: | .14 in, 3.55 mm |
Connector Assembly Type: | PCB Mount Receptacle |
PCB Contact Termination Area Plating Thickness: | 23.622 µin, .6 µm |
Material Flammability Standard: | UL 94V-0 |
Part Aliases: | 5223008-3 |
SKU: | AMP5223008-3 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |