Introducing the FB-5R Future Bus+ board-to-board connector, designed for high-performance signal transmission in electronic systems. With a compact 5-row configuration and 180 signal positions, this connector offers reliable connectivity for demanding applications. Featuring Through Hole - Press-Fit termination and durable LCP housing material, it ensures secure mounting and long-term durability. The gold-plated contact mating area with a thickness of .76 µm guarantees excellent signal integrity, while the 180 Ω impedance and 3 A contact amperage support efficient data transmission. Operating in a wide temperature range from -67 to 257 °F, this connector is suitable for versatile environments. Its UL 94V-0 rated housing and RoHS compliance ensure safety and environmental responsibility. Ideal for use in data and device applications, the FB-5R is a critical component for high-speed signal processing and connectivity.
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Stock Location: In Stock
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Pricing
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Product Category:
Manufacturer: TE Connectivity
Manufacturer Part Number: 5223008-6
Series: Z-PACK Future Bus+
Housing Material: LCP (Liquid Crystal Polymer)
Number of Rows: 5
Mount Type: Board Mount
Termination Method: Through Hole - Press-Fit
Contact Material: Phosphor Bronze
Pitch: .079 in, 2 mm
Voltage: 30 V AC
Contact Type: Socket
Impedance: 180 Ω
Package Quantity: 8
Contact Amperage: 3 A
Number of Positions: 180
Housing Color: Natural
Mount Orientation: Right Angle
Insulation Resistance: 5 MΩ
GPL: 473
Packaging: Tube
Operating Temperature Range: -67 - 257 °F
Circuit Application: Signal
Contact Mating Area Plating: Gold
Contact Mating Area Plating Thickness: 29.921 µin, .76 µm
PCB Retention: Without
PCB Contact Termination Area Plating: Tin
PCB Thickness (Recommended): 1.3 mm, .76 in
Connector Height: 13.3 mm, .523 in
Sealable: No
Mating Alignment: With
Mating Alignment Type: Polarization
GPL Description: Data and Devices
Connector and Contact Terminate To: Printed Circuit Board
Product Code: 3963
Number of Signal Positions: 180
Contact Layout: Matrix
Connector System: Board to Board
Stackable: No
ECCN: EAR99
Dielectric Withstanding Voltage: 1000 V AC
Board to Board Configuration: Right Angle
Contact Mating Area Plating Finish: Matte
Contact Shape: Dual Beam
PCB Mount Alignment: With
PCB Mount Alignment Type: Locating Posts
Application Solder Feature: Board Standoff
Termination Post Tail Length: .14 in, 3.55 mm
Connector Assembly Type: PCB Mount Receptacle
PCB Contact Termination Area Plating Thickness: 23.622 µin, .6 µm
Material Flammability Standard: UL 94V-0
Part Aliases: 5223008-6
SKU: AMP5223008-6

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes: