5223524-1
2MMFB,5R,ASY,030,SIG,HDR,EN
Introducing the Z-PACK Future Bus+ Board-to-Board Connector, a high-performance solution for power and signal transmission in electronic systems. With five rows of 30 signal positions each, this connector offers seamless connectivity in a compact design. Featuring right-angle mount orientation and through-hole press-fit termination, it ensures secure attachment to the PCB. The housing, made of LCP (Liquid Crystal Polymer) in a natural color, meets UL 94V-0 flammability standards for enhanced safety. Gold-plated phosphor bronze contacts with a contact impedance of 30 Ω guarantee reliable signal transmission. Operating in a wide temperature range from -67 to 257 °F, this connector is suitable for diverse applications. Whether you're designing telecommunications equipment, industrial machinery, or consumer electronics, the Z-PACK Future Bus+ Connector delivers performance and durability. With RoHS compliance and ECCN designation of EAR99, it meets international standards for environmental responsibility and export control. Elevate your PCB connectivity with this cutting-edge connector, designed for the future of electronic systems.
Product Category: | |
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Manufacturer: | TE Connectivity |
Manufacturer Part Number: | 5223524-1 |
Series: | Z-PACK Future Bus+ |
Amperage: | 3 A |
Housing Material: | LCP (Liquid Crystal Polymer) |
Number of Rows: | 5 |
Mount Type: | Board Mount |
Termination Method: | Through Hole - Press-Fit |
Contact Material: | Phosphor Bronze |
Contact Plating: | Gold over Palladium Nickel |
Body Orientation: | Right Angle |
Pitch: | .079 in, 2 mm |
Voltage: | 30 V AC |
Contact Type: | Pin |
Impedance: | 30 Ω |
Package Quantity: | 48 |
Contact Amperage: | 3 A |
Number of Positions: | 30 |
Housing Color: | Natural |
Mount Orientation: | Right Angle |
Insulation Resistance: | 5 MΩ |
GPL: | 473 |
Packaging: | Tube |
Operating Temperature Range: | -67 - 257 °F |
Circuit Application: | Power & Signal |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | 29.921 µin, .5 µm |
PCB Retention: | Without |
Contact Underplating Material: | Nickel |
PCB Contact Termination Area Plating: | Tin |
PCB Thickness (Recommended): | 1.3 mm, .5 in |
Connector Height: | 13.5 mm, .531 in |
PCB Retention Type: | Action/Compliant Tail |
Sealable: | No |
Mating Alignment: | With |
Mating Alignment Type: | Polarization |
GPL Description: | Data and Devices |
Connector and Contact Terminate To: | Printed Circuit Board |
Product Code: | 2370 |
Number of Signal Positions: | 30 |
Contact Layout: | Matrix |
Connector System: | Board to Board |
Stackable: | No |
ECCN: | EAR99 |
Dielectric Withstanding Voltage: | 1000 V AC |
Board to Board Configuration: | Right Angle |
Contact Mating Area Plating Finish: | Matte |
PCB Mount Alignment: | With |
PCB Mount Alignment Type: | Locating Posts |
Application Solder Feature: | Board Standoff |
Termination Post Tail Length: | .132 in, 3.35 mm |
Connector Assembly Type: | PCB Mount Header |
PCB Contact Termination Area Plating Thickness: | 1.969 µin, .5 µm |
Contact Mating Area Length: | .226 in, 5.75 mm |
Material Flammability Standard: | UL 94V-0 |
Part Aliases: | 5223524-1 |
SKU: | AMP5223524-1 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |