787942-9
100 50SR R/A RCPT,REDESIGN
The AMPLIMITE 0.50 Series offers high-performance connectivity with these 100-position D-Sub Receptacles. Designed for rugged durability, these connectors feature a Full Metal Shell and Through Hole - Solder termination for secure attachment. With Gold and Gold Flash plating over Palladium Nickel, they ensure excellent signal conductivity. The two-row design, with a standard profile, facilitates easy installation in various applications. Mating retention is assured with the latch mechanism. Packaged in tubes, these RoHS compliant connectors are ideal for industrial and commercial use. Upgrade your connectivity solutions with the AMPLIMITE 0.50 Series D-Sub Receptacles.
| Product Category: | |
|---|---|
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | 787942-9 |
| Series: | AMPLIMITE 0.50 Series |
| Amperage: | 1 A |
| Gender: | Receptacle |
| Number of Rows: | 2 |
| Termination Method: | Through Hole - Solder |
| Contact Plating: | Gold, Gold Flash over Palladium Nickel |
| Number of Positions: | 100 |
| Profile: | Standard |
| Mating Retention Type: | Latch |
| Packaging: | Tube |
| Shell Type: | Full Metal Shell |
| SKU: | AMP787942-9 |
| Shell Plating Material: | Nickel |
| Shell Material: | Carbon Steel |
| Bracket Plating Material: | Nickel over Copper |
| Post Size: | .012 in |
| Bracket Material: | Zinc |
| Post Plating Material: | Tin-Lead over Nickel |
| PCB Mount Orientation: | Right Angle |
| PCB Contact Termination Area Plating Material: | Tin-Lead |
| Contact Mating Area Plating Thickness: | 30 µin |
| Contact Underplating Material: | Nickel |
| Contact Base Material: | Phosphor Bronze |
| PCB Thickness (Recommended): | .093 in |
| Centerline (Pitch): | 1.27 mm / .05 in |
| Housing Material: | Thermoplastic |
| Housing Color: | Black |
| UL Flammability Rating: | UL 94V-0 |
| Approved Standards: | UL E28476 |
| Connector Mounting Type: | Board Mount |
| PCB Mount Alignment: | Without |
| PCB Mount Retention Type: | Boardlock |
| Montageausrichtung der Leiterplatte: | Without |
| PCB Mount Retention: | With |
| Mounting Hole Diameter: | .125 in |
| PCB Mounting Style: | Through Hole - Solder |
| Mating Retention: | With |
| Mating Alignment: | Without |
| Boardlock Plating Material: | Tin-Lead |
| Boardlock Material: | Copper Alloy |
| Mating Connector Lock Type: | Mounting Holes |
| Mating Connector Lock: | With |
| Circuit Application: | Signal |
| Row-to-Row Spacing: | .1 in / 2.54 mm |
| Sealable: | No |
| Connector Type: | Connector Assembly |
| Product Type: | Connector |
| Connector System: | Cable-to-Board |
| Shielded: | Yes |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Termination Post Length: | 3.66 mm / .144 in |
| Operating Temperature Range: | -55 - 105 °C / -67 - 221 °F |
| Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |