5223004-3
FB-5R,ASY,090,SIG,REC,SL,2.73
Introducing the FB-5R,ASY,090,SIG,REC,SL,2.73 Z-PACK Future Bus+ connector, a high-performance solution for your signal transmission needs. With a housing made of LCP (Liquid Crystal Polymer) and featuring 90 contact positions arranged in a 5-row matrix layout, this connector ensures reliable connectivity in demanding applications. The through-hole solder termination method and phosphor bronze contact material guarantee secure and durable attachment to your PCB. Operating within a wide temperature range of -67 to 257 °F, this connector is suitable for various environments. Its gold-plated contact mating area with a thickness of .05 µm provides excellent signal integrity. With an impedance of 90 Ω and a voltage rating of 30 V AC, it meets high-speed signal transmission requirements with ease. Whether you're designing for data and devices or other signal applications, this UL 94V-0 rated connector offers exceptional performance and durability. Packaged in tubes for convenience, it is ideal for automated assembly processes. Compliant with RoHS standards, you can trust in the environmental responsibility of this connector. Elevate your board-to-board connectivity with the FB-5R,ASY,090,SIG,REC,SL,2.73 connector.
Product Category: | |
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Manufacturer: | TE Connectivity |
Manufacturer Part Number: | 5223004-3 |
Series: | Z-PACK Future Bus+ |
Housing Material: | LCP (Liquid Crystal Polymer) |
Number of Rows: | 5 |
Mount Type: | Board Mount |
Termination Method: | Through Hole - Solder |
Contact Material: | Phosphor Bronze |
Pitch: | .079 in, 2 mm |
Voltage: | 30 V AC |
Contact Type: | Socket |
Impedance: | 90 Ω |
Package Quantity: | 16 |
Contact Amperage: | 3 A |
Number of Positions: | 90 |
Housing Color: | Natural |
Mount Orientation: | Right Angle |
Insulation Resistance: | 5 MΩ |
GPL: | 473 |
Packaging: | Tube |
Operating Temperature Range: | -67 - 257 °F |
Circuit Application: | Signal |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .05 µm, 1.969 µin |
PCB Retention: | Without |
PCB Contact Termination Area Plating: | Tin |
PCB Thickness (Recommended): | .05 in, 1.3 mm |
Connector Height: | 13.3 mm, .523 in |
PCB Retention Type: | Hold-Down Post |
Sealable: | No |
Mating Alignment: | With |
Mating Alignment Type: | Polarization |
GPL Description: | Data and Devices |
Connector and Contact Terminate To: | Printed Circuit Board |
Product Code: | 3963 |
Number of Signal Positions: | 90 |
Contact Layout: | Matrix |
Connector System: | Board to Board |
Stackable: | No |
ECCN: | EAR99 |
Dielectric Withstanding Voltage: | 1000 V AC |
Board to Board Configuration: | Right Angle |
Contact Mating Area Plating Finish: | Matte |
Contact Shape: | Dual Beam |
PCB Mount Alignment: | With |
PCB Mount Alignment Type: | Locating Posts |
Application Solder Feature: | Board Standoff |
Termination Post Tail Length: | .107 in, 2.73 mm |
Connector Assembly Type: | PCB Mount Receptacle |
PCB Contact Termination Area Plating Thickness: | 150 µin, 3.81 µm |
Material Flammability Standard: | UL 94V-0 |
Part Aliases: | 5223004-3 |
SKU: | AMP5223004-3 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |