208659-1240
2.00mm Pitch, iGrid PCB Header, Dual Row, Right-Angle, Through Hole, 0.10µm Gold (Au) Plating, Positive Lock, 12 Circuits, Tray, 3.20mm PC Tail Length, Natural
Introducing the iGrid 208659 series, a cutting-edge solution for your PCB connectivity needs. With a compact design and right-angle orientation, these PCB pin headers offer seamless integration into your electronic assemblies. Featuring gold-plated contact mating areas, they ensure reliable and high-performance connections. Certified for RoHS compliance, you can trust in their quality and environmental responsibility. Operating smoothly in a wide temperature range from -40 to 105°C, these headers are built to withstand harsh conditions. With 12 positions and a 2mm pitch on each of the two rows, they provide ample connectivity options. Ideal for through-hole termination, these headers are perfect for various applications in industries like telecommunications, automotive, and consumer electronics. Trust in the iGrid 208659 series for efficient and durable PCB connections.
Product Category: | |
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Manufacturer: | Molex |
Manufacturer Part Number: | 208659-1240 |
Series: | 208659 - iGrid |
Amperage: | 2 A |
Number of Rows: | 2 |
Termination Method: | Through Hole |
Pitch: | 2 mm |
Orientation: | Right Angle |
Number of Positions: | 12 |
Operating Temperature Range: | -40 - 105 °C |
Contact Mating Area Plating: | Gold |
Part Aliases: | 2086591240 |
SKU: | MOL208659-1240 |
Supplier Product: | iGrid |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
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10/01/2023 | 513897 - Equipment Transfer, Production Transfer or Rearrangement. 501876/208659 series products will be transferred from Japan vendor to Ansan plant in Korea for the productivity improvement & stable delivery performance If this PCN will be completed, it will only be produced at the Ansan plant To better serve our customers and leverage our global manufacturing footprint. |
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