208659-2641

2.00mm Pitch, iGrid PCB Header, Dual Row, Right-Angle, Through Hole, 0.10µm Gold (Au) Plating, Positive Lock, 26 Circuits, Tray, 3.20mm PC Tail Length, Black

Introducing the iGrid Series, a cutting-edge lineup of PCB Connectors designed for seamless integration in electronic assemblies. With a low amperage of 2A, they offer reliable power transfer across 26 positions, ensuring efficient connectivity. Featuring a through-hole termination method and right-angle orientation, installation is a breeze for professionals. The gold plating on the contact mating area guarantees optimal signal transmission, while RoHS compliance underscores our commitment to environmental responsibility. Operating flawlessly in temperatures ranging from -40 to 105°C, these connectors are ideal for a wide range of applications in various industries. Trust in the iGrid Series for dependable performance and longevity in your electronic projects.
Availability
Immediate Shipment: NA
Stock Location: In Stock
Factory Stock: Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple: NA/NA
Pricing
CALL: 800.400.7041
Product Category:
Manufacturer: Molex
Manufacturer Part Number: 208659-2641
Series: 208659 - iGrid
Amperage: 2 A
Number of Rows: 2
Termination Method: Through Hole
Pitch: 2 mm
Orientation: Right Angle
Number of Positions: 26
Operating Temperature Range: -40 - 105 °C
Contact Mating Area Plating: Gold
Part Aliases: 2086592641
SKU: MOL208659-2641
Supplier Product: iGrid

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes:

Product Change Notice

Effective Date Description of Change Download
10/01/2023 513897 - Equipment Transfer, Production Transfer or Rearrangement. 501876/208659 series products will be transferred from Japan vendor to Ansan plant in Korea for the
productivity improvement & stable delivery performance
If this PCN will be completed, it will only be produced at the Ansan plant
To better serve our customers and leverage our global manufacturing footprint.
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